
New IBM CEO sees her salary doubled
Embedded News -
1 hour 40 min ago
The new CEO of IBM has had her salary doubled from $800,000 to $1.5 million according to a regulatory filing.
View the full article HERE.
View the full article HERE.
IBM SmartCamp startups attempt to solve world problems
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1 hour 40 min ago
With tech start-ups taking the world by storm, industry heavyweight IBM is plowing venture capital into seedling companies it believes can best solve the analytical challenges and public infrastructure problems of what it’s calling the “smarter planet”.
View the full article HERE.
View the full article HERE.
Steve Appleton in retrospect
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1 hour 40 min ago
A retrospective on the career of Steve Appleton, Chairman and CEO of memory chip vendor Micron Technology, who died Friday in a plane crash.
View the full article HERE.
View the full article HERE.
ARM Mulls Non-Volatile Memory IP acquisition
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1 hour 40 min ago
ARM CEO Warren East (shown) says the U.K. processor IP vendor would consider acquiring non-volatile memory IP as a way to bolster its physical IP division.
View the full article HERE.
View the full article HERE.
Panasonic predicts loss of $10 billion for fiscal year
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1 hour 40 min ago
Panasonic, one of the Japanese electronics giants, has said that it expects to make a net loss of 780.0 billion yen (about $10.2 billion) in the fiscal year that runs to March 31, 2012.
View the full article HERE.
View the full article HERE.
Sonics, Tensilica team to improve IP efficiency
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1 hour 40 min ago
Sonics Inc., a licensor of interconnect IP, has announced its on-chip networks will support the processor interface (PIF) from Tensilica Inc., a licensor of DSP and application-specific processor cores.
View the full article HERE.
View the full article HERE.
Microchip posts weak fiscal Q3, outlook brighter
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1 hour 40 min ago
Microcontroller chip company Microchip Technology Inc. has reported that its fiscal third-quarter profit dropped 23.5 percent year-on-year to $77.5 million as net sales slipped back to $329.2 million, down 3.4 percent sequentially and down 10.5 percent year-over-year.
View the full article HERE.
View the full article HERE.
Video: Are tech jobs returning to the U.S.?
Embedded News -
1 hour 40 min ago
EE Times hit the exhibition floor at DesignCon 2012 to get engineers' perspectives on whether high-tech jobs are coming back to the U.S.
View the full article HERE.
View the full article HERE.
NXP gives sneak peek at new engineering workbench app
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1 hour 40 min ago
Semiconductor company NXP has expanded its mobile app efforts by launching a new iPad app meant to help engineers put together projects, store and easily share them.
View the full article HERE.
View the full article HERE.
Video: HP's Prith Banerjee discusses HP labs, ARM servers and optical interconnects
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1 hour 40 min ago
Director of HP Labs Prith Banerjee gave his DesignCon keynote on the future of optical interconnects in the industry, including photonic interconnects and light to communicate instantaneously.
View the full article HERE.
View the full article HERE.
Rick Merritt DesignCon wrap up; 3D stacking, optical interconnects
Embedded News -
Thu, 02/02/2012 - 23:00
EE Times editor Rick Merritt wraps up some of the key trends at DesignCon 2012, including the shifts in design flow from copper to optical interconnects and the cost dynamic challenges involved in the switch.
View the full article HERE.
View the full article HERE.
ASPs weigh as Hynix' losses reduced in Q4
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Thu, 02/02/2012 - 23:00
Hynix Semiconductor Inc. made a smaller loss in the fourth quarter than it did in the third quarter on sequentially increasing sales. The company was hit by declining average selling prices in both the DRAM and NAND flash memory.
View the full article HERE.
View the full article HERE.
CMOS timing startup raises $2.3 million
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Thu, 02/02/2012 - 23:00
EoSemi Ltd. (Congleton, England), a developer of CMOS replacements for quartz oscillators, has announced it has secured a $2.3 million (£1.5milion) second tranche of funding.
View the full article HERE.
View the full article HERE.
U.K. to spend $120 million on graphene institute
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Thu, 02/02/2012 - 23:00
The U.K. government has said it will spend £70 million (about $120 million) to fund a national institute of graphene research and commercialisation activities, in Manchester, England.
View the full article HERE.
View the full article HERE.
CNSE receives federal grants for nanotechnologies
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Thu, 02/02/2012 - 23:00
Federal funding of more than $5 million is being given to the College of Nanoscale Science and Engineering (CNSE) of the University at Albany for a host of nanotechnology-enabled education and research programs.
View the full article HERE.
View the full article HERE.
Infineon profits trimmed by lower sales
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Thu, 02/02/2012 - 23:00
German chipmaker Infineon Technologies AG has reported a profitable first quarter to its 2012 financial and forecast somewhere between a flat revenue and a slight decline in revenue for its second fiscal quarter.
View the full article HERE.
View the full article HERE.
TSMC plans 3-D IC assembly launch early in 2013
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Thu, 02/02/2012 - 23:00
Leading IC foundry Taiwan Semiconductor Manufacturing Co. Ltd. plans to announce 3-D IC assembly service as a general offering at the beginning of 2013, according to Maria Marced, president of TSMC Europe.
View the full article HERE.
View the full article HERE.
Panel probes T&M’s tech chiefs
Embedded News -
Wed, 02/01/2012 - 23:00
A DesignCon panel probed the leaders of the major test and measurement companies on a broad range of issues.
View the full article HERE.
View the full article HERE.
HP R&D chief shows road to terabyte backplane
Embedded News -
Wed, 02/01/2012 - 23:00
Prith Banerjee, director of HP Labs, described in a DesignCon keynote the path to a terabyte/second backplane as one step toward tomorrow’s computer architectures.
View the full article HERE.
View the full article HERE.
Discipline key to engineering innovation, says Microsoft exec
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Wed, 02/01/2012 - 23:00
The convergence of technical trends are creating an environment full of innovative ideas, but delivering great products to market takes flexibility, focus, and discipline, said Microsoft CVP Ilan Spillinger during a DesignCon keynote on Tuesday.
View the full article HERE.
View the full article HERE.
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